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US Patent Issued to Adeia Semiconductor Bonding Technologies on Oct. 27 for "Low temperature direct bonding" (California Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,975, issued on Oct. 27, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Low temperature direct bonding" ... Read More


US Patent Issued to TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) on Oct. 27 for "Transfer substrate, method for transferring microdevice and display panel" (Chinese Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,976, issued on Oct. 27, was assigned to TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) Co. LTD. (Xiamen, China). "Transfer substrate... Read More


US Patent Issued to Tianma Advanced Display Technology Institute (Xiamen) on Oct. 27 for "Display panel and display device" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,977, issued on Oct. 27, was assigned to Tianma Advanced Display Technology Institute (Xiamen) Co. Ltd. (Xiamen, China). "Display panel and ... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 27 for "Semiconductor device and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,978, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device and method... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Stack-type semiconductor package with improved operating stability" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,979, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Stack-type semiconductor package with improv... Read More


US Patent Issued to MURATA MANUFACTURING on Oct. 27 for "High frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,980, issued on Oct. 27, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "High frequency module and communication device"... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 27 for "Ring structure surrounding a package component" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,981, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Ring structure surrounding a pa... Read More


US Patent Issued to Avago Technologies International Sales on Oct. 27 for "Systems and methods for connecting integrated circuits" (California Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,982, issued on Oct. 27, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore). "Systems and methods for connecting i... Read More


US Patent Issued to Hefei BOE Ruisheng Technology, Beijing BOE Technology Development on Oct. 27 for "Light-emitting substrate and manufacturing method therefor, backlight module, and display apparatus" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,983, issued on Oct. 27, was assigned to Hefei BOE Ruisheng Technology Co. Ltd. (Anhui, China) and Beijing BOE Technology Development Co. Ltd... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 27 for "Photonic semiconductor device and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,984, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Photonic semiconductor device and m... Read More